eh là bas ma
Well-known member
Hello,
I've been using some residue cleaner recently, and i notice that pads are much harder to reflow after cleaning the pcb.
When applying heat to reflow and improve some soldering joint, i can see bubbles and strange things going on on the pad, it feels like i should remove the cleaned solder and use some fresh one to be safe.
I guess the cleaner is also removing flux from all the soldering pads ?
So we should only clean the pcb at the end, once we made sure everything works ?
This might be a silly question with an obvious answer, but i'd be glad to know for sure.
Every observations and suggestions are welcome !
I've been using some residue cleaner recently, and i notice that pads are much harder to reflow after cleaning the pcb.
When applying heat to reflow and improve some soldering joint, i can see bubbles and strange things going on on the pad, it feels like i should remove the cleaned solder and use some fresh one to be safe.
I guess the cleaner is also removing flux from all the soldering pads ?
So we should only clean the pcb at the end, once we made sure everything works ?
This might be a silly question with an obvious answer, but i'd be glad to know for sure.
Every observations and suggestions are welcome !