ICs & silicon transistors can tolerate soldering just fine, but keep the time where the iron is touching the leads to a minimum. Here's my method for soldering ICs: first solder two opposite corner leads to keep it in place while soldering the other leads. Wait several sec for the device to cool down, then solder a lead, wait, solder another lead, wait, etc. If you have multiple ICs, alternate between them so while one is being soldered, the others are cooling. Use a temperature-controlled iron and a small tip. Semiconductors always get installed at the end, so they're not getting heated while you solder everything else. The only exception is board-mounted pots go on at the very last because they obscure some of the other solder joints. Through-plated holes do not need to be completely filled from top to bottom, just all the way around on one side of the board. Here's how the NASA-trained pros solder: 1. apply a tiny drop of flux to each joint to be soldered. 2. melt a good sized puddle of solder onto the soldering iron tip and then transfer that to the solder joint. With most joints, you will not need to feed any more solder than that. The advantage of this method is that you're not heating the joint while you're waiting for the solder to melt because it's already molten. Inspect the joints with a magnifier and touch-up as req'd. At the end, flood the board with alcohol and scrub off the excess flux with a toothbrush.