General perf board question

jdduffield

Active member
When working with a perf board where the pads are isolated like this (see attached image), is it best to bridge the solder between connecting pads or is it better to bend the leads over and use that wire to make the connection?
 

Attachments

  • IMG_4793.jpeg
    IMG_4793.jpeg
    367 KB · Views: 6
Basically. I've only done one perf build, a silicon npn ff. I ended up making traces with spare bits of clipped leads along with the component leads. Though requiring more auxiliary materials, I kinda just prefer etching for single sided boards. Even more than vero. Best of luck, though!
 
Last edited:
Leads is definitely easier. I tried the bridge of solder blobs method, but it was difficult and ugly. I’ve seen it done well, but I couldn’t get the hang of it.
 
Using the leads is the better option, unless you plan to replace components. Have a solder sucker pump and wick ready.
Additional and longer connections can be made using insulated wire.
 
Back
Top